View FR2001H-T_4349997.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Specification FR2001H-T
SSC
Drawn Approval
CUSTOMER
Approval
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
1. 2. 3. 4. 5. 6. 7. Packing Soldering
CONTENTS
Absolute Maximum Ratings Electro Characteristics Outline Dimension Electro-Optical characteristic Diagram
Precaution for use
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
-
FR2001H-T
Description
FR2001H-T
Features
* 3.5 (W) X 2.8 (D) X 0.6 (T) mm
Small size suitable for compact appliances. Surface-mounted chip LED device. Pb-free and RoHS complaint component. Tape and Reel packing. Increases the life time of battery.
* Chip LED of Reflector type * Viewing Angle: 140 * Dominant Wavelength : 625 nm
Applications
* Electric appliance * Other decoration lighting
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
1. Absolute maximum ratings
(Ta=25)
Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operation Temperature Storage Temperature
Symbol Pd IF IFM *1 VR Topr. Tstg.
Value 80 30 50 5 -40 ~ 100 -40 ~ 100
Unit mW mA mA V
*1 IFM conditions: Pulse width Tw0.1ms and Duty ratio1/10.
2. Electro-Optical Characteristics
(Ta=25)
Parameter Forward Voltage Reverse Current Luminous Intensity*2 Luminous Flux Wavelength Spectral Bandwidth Viewing Angle*3
Symbol VF IR IV d 21/2
Condition IF=20 VR=5V IF=20 IF=20 IF=20 IF=20 IF=20
Min -
Typ 2.0 460 1.45 625 15 140
Max 2.6 10 -
Unit V mcd lm nm nm
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv 10 %, D 2 nm, VF 0.1 V)
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
3.Outline Dimension
( Tolerance: 0.1, Unit: mm )
[TOP VIEW]
[SIDE VIEW]
[BOTTOM VIEW]
[INNER CIRCUIT]
- Recommended Soldering Design
* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Lead Frame Epoxy Resin Au Plating Copper Alloy
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current IF(mA)
Luminous Intensity IV(%)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Electro-Optical characteristic Diagram
Forward Current vs. Forward Voltage (per die)
100
(Ta=25 OC )
10
1 1.7
1.8
1.9
2.0
2.1
2.2
Forward Voltage VF(V)
Relative Luminous Intensity vs Forward Current
200
(Ta=25 OC )
160
120
80
40
0
0
5
10
15
20
25
30
35
Rev. 00 September 2008 www.ZLED.com
Forward Current IF(mA)
Document No. : SSC-QP-7-07-24 (Rev.00)
Forward current IF(mA)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Ambient Temperature vs. Allowable Forward Current (per die)
40
30
20
10
0 -60
-40
-20
0
20
40
60
80
100
120
A m b ie n t te m p e ra tu re T a ( )
Radiation Diagram
(Ta=25 OC )
90
1.0 0.8 0.6 0.4 0.2
0.0 180 150
120
60
30
0
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
(2.75)
22 13
0.2
Label
Tolerance: 0.2, Unit:
(1) Quantity:2,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be 0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 00
60
+0.2 -0
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Packing
4.00.1 1.750.1 1.5
+0.1 -0
0.250.05
3.50.05
8.00.1
Marking Direction
0.850.1
180
+0 -3
11.4 9
0.3
2 0.2
September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Reel Packing Structure
Reel
P/N : # # # # # # # # # #
##
SSC-FR2001H-T
L ot N o
#########
: 2000
Aluminum Vinyl Bag
P/N : # # # # # # # # # #
##
SSC-FR2001H-T
Lot N o
#########
: 2000
Outer Box
*Material: Paper(SW3B(B)) a 7inch 245 TYPE SIZE(mm) c b 220 142
c
TUV
MADE IN KOREA
CHIP LED
PART : SSC-FR2001H-T CODE : Q'YT : 20,000EA LOT NO : DATE :
SEOUL SEMICONDUCTOR CO.,LTD
Acriche
RoHS
Semiconductor EcoLight
b a
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Soldering
(1) Lead Solder
Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 120 sec. Max. 240 Max.
2.5~5 C / sec.
2.5~5 o C / sec. Pre-heating 120~150 oC
240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC
120sec. Max.
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 120 sec. Max. 260 Max.
1~5 o C / sec.
1~5 o C / sec. Pre-heating 150~200 o C
260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC
120sec. Max.
10 sec. Max.
(3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280C under soldering iron.
(4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don't guarantee the products.
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
7. Precaution for use
(1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.
Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)

▲Up To Search▲

Price & Availability of FR2001H-T

	To Download FR2001H-T Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .